Coatings

Imicure

Imidazole Curing Agents & Accelerators for One Part Dicyandiamide, Anhydride & Phenolic Systems

Imicure Imidazole curing agents are latent catalysts for epoxy systems which offer pot life ranges from a few hours to six months, rapid cure beyond activation temperatures, and high thermal and chemical resistance.  These products are excellent accelerators for other curing agents such as dicyandiamide, phenolics, and anhydrides.

Key Features

Imicure AMI-1:  An elevated temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents.  Soluble in water and common polar organic solvents.  Develops Tg ≈ 150 °C in heat-cured systems.  Primary applications include Prepreg composites, adhesives, and electronic encapsulation.

Imicure AMI-2:  An elevated temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents.  Soluble in water and common polar organic solvents.  Develops Tg ≈ 150 °C in heat-cured systems.  Primary applications include electrical laminates, powder coatings, molding powders, and structural adhesives.

Imicure EMI-24:  A liquid imidazole which functions as both a curing agent and a cure accelerator for high performance epoxy resin systems.  With high reactivity, this medium viscosity liquid can be used alone or to accelerate dicyandiamide or anhydride cures. May solidify as a result of thermal or mechanical shock. Gradual warming above 115°F returns material to a stable liquid form.  Imicure EMI-24 provides the following advantages over other imidazole and amine curing agents and accelerators:

  • Printed Circuit Board Laminates—shorter B-stage cure times, reduced solvent requirements, excellent glass transition (Tg) temperatures.
  • Filament Winding Applications—long pot life, excellent physical properties, high heat distortion temperatures.
  • Casting Applications—long pot life, ease of handling, high heat distortion temperatures.
  • Adhesives—outstanding adhesion to wood, metal and glass.
  • Coatings—excellent shelf stability.

Imicure Imidazole:  An elevated temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1−5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents.  Soluble in water and common polar organic solvents.  Develops Tg ≈ 150 °C in heat-cured systems.  Primary applications include Prepreg composites, adhesives, and electronic encapsulation.

Recommended Applications

  • Structural adhesives
  • Pre-preg composites
  • Printed circuit board laminates
  • Filament winding
  • Casting
  • Coatings
  • Potting and encapsulation of electronic devices
  • Powder coatings
  • Molding powders