Amicure CG - Description
Amicure CG curing agents are latent curing agents for epoxy systems providing greater than six months shelf stability in one-package systems. Available in several physical forms.
Amicure CG
More information about Amicure CG
Amicure CG-NA: An unpulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solvent-based processes. It has no flow control additives to inhibit solubility and is soluble in polar solvents such as acetone and DMF. Amicure CG-NA has shelf stability of up to 6 months at 77 °F in properly formulated systems. Activation temperature can be varied from 356 °F to 203 °F with appropriate accelerator selection. Compliant with 21CFR 175.105 and 21CFR 175.300.8. Principal applications include electrical laminates, adhesives, and powder coatings where the total resin system is pulverized prior to extrusion.
Amicure CG-325G: A micronized grade of dicyandiamide pulverized to 90% less than 44 micron particle size, containing 1.5% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing agent for epoxy resins. Its fine particle size provides enhanced reactivity versus coarser grades. Amicure CG-325G has excellent dispersibility in liquid epoxy resin due to higher levels of flow agent. It has shelf stability up to 6 months at 77 °F in properly formulated systems. Activation temperature can be easily varied from 355 °F to 203 °F with appropriate accelerator selection. Compliant with 21CFR 175.105 and 21CFR 175.300.8. Principal applications include structural laminates, and one-component adhesives.
Amicure CG-1200G: A micronized grade of dicyandiamide pulverized to 90% less than 30 micron particle size, containing 1.5% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing agent for epoxy resins. Its fine particle size provides enhanced reactivity versus coarser grades. Amicure CG-1200G has excellent dispersibility in liquid epoxy resin due to higher levels of flow agent. It has shelf stability up to 6 months at 77 °F in properly formulated systems. Activation temperature can be easily varied from 355 °F to 203 °F with appropriate accelerator selection. Compliant with 21CFR 175.105 and 21CFR 175.300.8. Principal applications include structural adhesives, powder coatings, and structural laminates including solvent-free Prepregs.