Evonik

Amicure UR

Substituted Urea Curing Agents & Accelerators for One Part Systems

Amicure UR substituted urea curing agents are used as low toxicity replacements for conventional dicyandiamide accelerators.

Key Features

Amicure UR:   A substituted urea-based co-curing accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide-cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature.  Amicure UR is supplied as a micropulverized crystalline solid which is easily dispersed into liquid epoxy resin. It is also available on a custom basis in different mean particle sizes with or without the addition of fumed silica as a free flow agent.  Principal applications include one-component paste and film adhesives, high-performance composites, and Prepregs.

Amicure UR2T:   A substituted a substituted urea-based co-curing accelerator [1,1’-(4 methy-mphenylene)bis(3,3 dimethyl urea)] for dicyandiamide-cured epoxy resins.  Faster green strength adhesion build than Amicure UR. Also used at lower loadings than Amicure® UR for comparable acceleration.  Principal applications include one-component paste and film adhesives, high-performance composites, and Prepregs.

Amicure UR-D:   A co-curing accelerator for dicyandiamide-cured epoxy resins. It can be used to provide relatively long shelf stability while enabling rapid cure above its activation temperature.  1K Epoxy systems using Amicure UR-D accelerator also have good adhesion properties.  Principal applications include one-component adhesives and composite Prepregs.

Amicure UR 7/10:  Fine ground version of Amicure UR, 90% less than 10 micron particle size and is easily dispersed into liquid epoxy resin.  It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature.  Principal applications include one-component paste and film adhesives, and high-performance composites, especially in aerospace applications.

Amicure UR 10/30:   Fine ground version of Amicure® UR, 90% less than 30 micron particle size and is easily dispersed into liquid epoxy resin.  It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature.  Principal applications include one-component paste and film adhesives, and high-performance composites, especially in automotive applications.

Recommended Applications

  • One-pack paste and film adhesives
  • Heat-cure composites
  • Prepreg composites
  • Automotive
  • Aerospace