Evonik

Curezol

Imidazole Curing Agents & Accelerators for One Part Dicyandiamide, Anhydride & Phenolic Systems

Curezol Imidazole curing agents are latent catalysts for epoxy systems which offer pot life ranges from a few hours to six months, rapid cure beyond activation temperatures, and high thermal and chemical resistance.  These products are excellent accelerators for other curing agents such as dicyandiamide, phenolics, and anhydrides.

 

Key Features

Curezol C17Z:  Powdered imidazole accelerator for dicyandiamide, anhydride and phenolic curing agents. Offers good latency with rapid reaction at elevated temperatures. Principal applications include structural adhesives, molding powders, powder coatings and structural laminates.

Curezol 1B2MZ:  Non-crystallizing liquid with high reactivity which is an effective low-viscosity accelerator for anhydrides.  Principal applications include casting, potting and encapsulation in electrical and electronic applications.

Curezol 2E4MZ:  High-reactivity, low melting point accelerator used on its own or to accelerate for dicyandiamide, anhydride and phenolic curing agents.  When used as a curing agent, post cures of 200 ºC in silica flour filled formulations produce heat deflection temperatures of 200–300 C.  Principal applications include filament winding, electrical laminates, powder coatings, molding powders and structural adhesives.

Curezol 2MA OK:  Accelerator for dicyandiamide, anhydride and phenolic curing agents.  Provides best combination of latency and low-temperature cure.  Must be compounded at < 40 C to keep water of crystallization and to maintain latency. Principal applications include electrical and electronic insulation, solder-resistant inks, and structural adhesives.

Curezol 2MZ-Azine:  Accelerator for dicyandiamide and anhydride curing agents.  Principal applications include structural adhesives as well as electronic applications such as solder-resistant inks and insulating powders.

Curezol 2P4MZ:  Accelerator for dicyandiamide, anhydride and phenolic curing agents.  Principal applications include electrical laminates, molding compounds, potting compounds, solder mask inks, adhesives.

Curezol 2PZ:  Accelerator for dicyandiamide, anhydride and phenolic curing agents.  Principal applications include Prepreg composites, electronic encapsulation, electrical laminates, molding compounds and potting compounds.

Recommended Applications

  • Potting and encapsulation of electronic devices
  • One-pack structural adhesives for automotive and aerospace uses
  • Composites
  • Structural adhesives
  • Pre-preg composites
  • Encapsulation
  • Printed circuit board laminates
  • Filament winding
  • Casting
  • Coatings
  • Solder-resistant inks
  • Powder coatings
  • Molding powders